Surface Segregation of Boron in Dispersion - Strengthened Copper
نویسنده
چکیده
The improved yield strength of annealed dispersionstrengthened copper (DSC) over conventional OFE copper makes it a possible candidate for use in extremely high potential gradient particle accelerator structures where stability is of critical importance. Test brazes of such structures show that the surface of DSC is not readily wetted by conventional goldbased braze alloys used for copper. Surface analyses (by XPS and AES) of samples raised to brazing temperature show the presence of boron, which diffuses to the surface and possibly interferes with the wetting process. Boron is an intentional oxygen scavenger added to the DSC during manufacture. Alumina, the primary additive in the strengthening process, is not detected on the surface.
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